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STRUCTURE PRODUCT SERIES
Silicon monolithic integrated circuits 1chip motor driver for printer (H bridge driver 2ch, switching regulator, series regulator, reset output)
TYPE FUNCTION
BD64550EFV
Built-in thermal shut down circuit Built-in UVLO circuit
Absolute maximum ratings (Ta=25) Parameter Supply voltage Power dissipation Logic input voltage RIN applied voltage RNF voltage Motor driver maximum output current (peak500nsec) Motor driver maximum output current (DC) Switching Reg maximum output current (DC) Series Reg maximum output current (DC) Operating temperature range Storage temperature range Junction temperature
1 2
Symbol VM Pd VL VRIN VRNF IOUT(peak) IOUT(DC) IOUT IOUT TOPR TSTG Tjmax
Limit 40 1600 5.5 0.5 8.0 2.5 0.5 0.25 -25+85 -55+150 150
2 1
Unit V mW V V V A A A A
-0.45.5
70mmx70mmx1.6mm glass epoxy board. Derating in done at 12.8mW/ for operating above Ta=25. Do not exceed Pd, ASO and Tjmax=150.
Recommended operating conditions (Ta= -25+85) Parameter Supply voltage SCLK input frequency Switching Reg output voltage Symbol VM FSCLK Vswreg Min 7 3 Typ 24 Max 36 20 5 Unit V MHz V
This product isn't designed for protection against radioactive rays.
Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
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Electrical characteristics (Unless otherwise specified, Ta=25, V=24V) Parameter Overall VM current 1 VM current 2 H bridge 1 Output on resistance (source side) Output on resistance (sinking side) Output leak current Built-in diode forward direction voltage (source side) Built-in diode forward direction voltage (sinking side) H bridge 2 Output on resistancesource side Output on resistancesinking side Output leak current Built-in diode forward direction voltage (source side) Built-in diode forward direction voltage (sinking side) Current control VREF voltage range VREF pin outflow current RNF pin outflow current RNFS pin outflow current VREF-RNFS offset voltage Control logic High input voltage Low input voltage Input current Switching power source DSEN threshold voltage Output on resistance Leak current DUTY_MAX value Clock frequency DSEN pin outflow current Series power source Output voltage Leak current RESET pin Output voltage Leak current High VM threshold voltage Low VM threshold voltage L High motor UVLO voltage Low motor UVLO voltage Reset delay time VRSTL IRSTLEAK VMPORH VMPORL VMMTH VMMTL TPOR 0 0 6.3 5.9 13.5 12.5 50 6.5 6.1 15 14 80 0.2 10 6.7 6.3 16.5 15.5 110 V A V V V V msec VM at power on VM at power off Off motor only IDRAIN=1mA VSOUT ISLEAK 1.425 0 1.5 1.575 10 V A IOUT=70mA VSWBIAS RSWON ISWLEAK DMAX FSW IDSEN 0.873 0 130 0.9 0.8 92 200 0 0.927 1.04 10 270 1 V A % kHz A IOUT=250mA VM=36V VINH VINL IIN 2.0 0 21 33 5.5 0.8 45 V V A Input voltage=3.3V VREF IREF IRNF IRNFS VOFFSET 0.8 5 -15 0 15 0 0 3.5 1 30 1 15 V A A A mV VREF=2V RONH2 RONL2 ILEAK2 VFH2 VFL2 0 0.6 0.6 0.7 0.5 0.9 0.9 0.91 0.65 10 1.2 1.2 A V V IOUT=1A IOUT=1A VM=36V IOUT=1A IOUT=1A RONH1 RONL1 ILEAK1 VFH1 VFL1 0 0.6 0.6 0.6 0.4 0.9 0.9 0.78 0.52 10 1.2 1.2 A V V IOUT=1A IOUT=1A VM=36V IOUT=1A IOUT=1A IVM1 IVM2 8 12 mA mA VM=7V VM=24V Symbol Limit Min. Typ. Max. Unit Conditions
REV. A
3/4 Package outline
Product No.
BD64550EFV
Lot No.
HTSSOP-B40 (Unit: mm)
Block diagram
VM2 32 VM2 33
8 9
Pin No. / Pin name
VM1 VM1
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12
Pin name NC OUT1M RNF1 RNF1 RNF1S NC OUT1P VM1 VM1 VM4 NC SWOUT NC ROUT NC RIN NC DSEN VREF2 VREF1
Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Pin name DGND SELECT DC2E DC2P STROBE SDATA SCLK RESET AGND NC VM3 VM2 VM2 OUT2M NC RNF2S RNF2 RNF2 OUT2P PGND
OUT2P 39 Predriver OUT2M 34 Predriver
7 2
OUT1P OUT1M
RNF2 37 RNF2 38 RNF2S 36 VREF2 19 1/10
CONTROL LOGIC
3 4 5
RNF1 RNF1 RNF1S VREF1
1/10
20
SELECT 22
31
VM3 RESET
DC2P 24 SCLK(DC1P) 27 Selector DC2E 23 STROBE 25 SDATA 26 AGND 29 RIN 16 REG ROUT 14
BG BG
28
Serial Control
POWER MONITOR
RESET
40 21
PGND DGND
13 14 15 16 17 18 19 20
OSC
UVLO
TSD
BG
10
VM4
DRIVER SWOUT
12
18
DSEN
NC: Non Connection
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Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (TOPR) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. (7) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150, and higher, coil output to the motor and regulator output will be OFF, and reset output will be L. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
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Appendix
Notes
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Appendix-Rev4.0

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